条件に該当する製品58件
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MR6-P1100
Kontron PowerPC (FreeScale) COM Express 防衛Rugged design with soldered components • Reliable computing capabilities for applications needing higher immunity to shock and vibration Freescale QorIQ P1 family processors in varying levels of performance-per-watts • Delivers high performance coupled with low power consumption • Configure the module for the level of performance-per-watt your application requires Dynamic thermal management • Enables controlled system shutdown to avoid damage to equipment • Offers cost saving by allowing simulation in the lab before conducting field tests Flexible options • Additional shock and vibration protection • Extended operating temperature range for environments with temperature extremes
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mCOM10-L1500 Rugged COM Express Module – Type 10 ‘Mini’ module
GE intelligent platforms AMD COM Express 防衛Form Factor : COM Express mini, Type 10 Processor : AMD Embedded G-Series SOC Maximum Memory : Up to 8 GB DDR3 SDRAM Ethernet : Gigabit Ethernet Conformal Coating : Option Operating System (OS) Support : Linux, VxWorks, Windows Memory : Up to 8GB DDR3 Operating Temp : 0°C to +65°C
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mCOM10-K1 Mini COM Express
GE intelligent platforms GPGPU COM Express 防衛• Small form factor - Size (84x55 mm) makes the mCOM10-K1 ideal for applications where compact size is critical • Rugged design with soldered components - Reliable computing capabilities for applications needing higher immunity to shock and vibration • NVIDIA Tegra K1 SOC platform - Delivers a total of 327 GFLOPS of compute performance while drawing less than 10W power - General purpose computing on Graphics Processing Units (GPGPU) for data-intensive applications • Flexible options - Additional shock and vibration protection - Extended operating temperature range for environments with temperature extremes
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COMX-P40x0-ENP2 – RUGGEDIZED FREESCALE QORIQ™ MODULES
SMART Embedded Computing(旧Artesyn Embedded Technologies) PowerPC (FreeScale) COM Express 防衛・Freescale QorIQ P4040 or P4080 processor at 1.2GHz ・2 or 4 GB of soldered-down DDR3-1333 ECC memory ・95 mm x 125 mm COM Express Basic footprint ・-40 °C to +71 °C operating temperature range ・Shock and vibration hardened ・16 configurable SERDES lanes available for maximum flexibility
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COMX-P4080 – FREESCALE QORIQ™ P4040 OR P4080 MODULES
SMART Embedded Computing(旧Artesyn Embedded Technologies) PowerPC (FreeScale) COM Express 通信・ キャリア・Freescale QorIQ P4040 or P4080 processors ・Four or eight Power Architecture cores running at 1.5 GHz ・Supports two channels of 2GB DDR3-1333 ECC SO-UDIMM (4GB max.) ・95 mm x 125 mm COM Express Basic footprint ・12 configurable SERDES lanes available for maximum flexibility
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COMX-P2020 – FREESCALE QORIQ™ P2020 MODULE
SMART Embedded Computing(旧Artesyn Embedded Technologies) PowerPC (FreeScale) COM Express 鉄道/交通・Freescale QorIQ P2020 processor ・Two e500 Power Architecture cores running at 1.2 GHz ・On-board XGI Z11M Graphics Processor Unit (GPU) ・Supports up to 2GB DDR3 ECC SO-UDIMM ・95 mm x 95 mm compact footprint ・MicroSD card slot for on-board storage
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COMX-P1022 – FREESCALE QORIQ™ P1022 MODULE
SMART Embedded Computing(旧Artesyn Embedded Technologies) PowerPC (FreeScale) COM Express ロボット 半導体製造機 生産中止品(EOL)・Freescale dual-core QorIQ P1022 processor ・Two cores running at 1.067 GHz ・Supports up to 2GB DDR3 SO-DIMM ・95 mm x 95 mm compact footprint ・DVI and LVDS Video output ・I2C Audio ・Ultra low power processing module (< 7 W)
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bCOM6-P1100
Kontron PowerPC (FreeScale) COM Express 鉄道/交通Rugged design with soldered components ・Reliable computing capabilities for applications needing higher immunity to shock and vibration Freescale QorIQ P1 family processors in varying levels of performance-per-watt ・Delivers high performance coupled with low power consumption ・Configure the module for the level of performance-per-watt your application requires Dynamic thermal management ・Enables controlled system shutdown to avoid damage to equipment ・Offers cost saving by allowing simulation in the lab before conducting field tests Flexible options ・Additional shock and vibration protection ・Extended operating temperature range for environments with temperature extremes
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bCOM6-L1200
Kontron Intel COM Express 通信・ キャリアRugged design with soldered components ・Reliable computing capabilities for applications needing higher immunity to shock and vibration VIA Nano or VIA Eden processors in varying levels of performance-per-watt ・Delivers high performance coupled with low power consumption ・Configure the module for the level of performance-per-watt your application requires Flexible options ・Additional shock and vibration protection ・Extended operating temperature range for environments with temperature extremes ・Conformal coating for protectio against dust, moisture and chemicals
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bCOM2-L1100
Kontron Intel COM Express 通信・ キャリアRugged design with soldered components ・Reliable computing capabilities for applications needing higher immunity to shock and vibration Intel Core 2 Duo processors in varying levels of performance-per-watts ・Delivers mid- to high-level performance coupled with low power consumption ・Configure the module for the level of performance-per-watt your application requires Dynamic thermal management ・Enables controlled system shutdown to avoid damage to equipment ・Offers cost saving by allowing simulation in the lab before conducting field tests Flexible options ・Additional shock and vibration protection ・Extended operating temperature range for environments with temperature extremes ・Conformal coating for protection against dust, moisture and chemicals ・Solutions available based on standard or custom carriers